For the last several decades, the electronics industry has delivered new innovations year after year by continually shrinking the electronics inside consumer and computing devices. However, as experts all agree, this continued progression (popularly known as Moore’s Law), cannot continue much longer due to inherent limitations in scaling silicon-based devices using conventional means.
That is the reason industry giants such as Intel, TSMC, Global Foundries and Samsung are turning to new materials such as fullerenes to further conventional imaging and chip fabrication technology to keep Moore’s law moving forward. Fullerenes are super strong, exhibit high-etch resistance, and are low cost. Due to their tiny 1 nanometer (nm) size, photoresists and hard masks made from them enable complex features at 15 nm and can be readily scaled down below 7 nm in the future.
Nano-C is one of the world’s leading providers of fullerenes and its materials have been used successfully for years in standard CMOS fabs around the globe to increase the density and complexity of features on a wafer. The advantages of Nano-C’s materials include the following:
- Can be used in standard CMOS fabs that use silicon today
- Enables EUV, the next generation of lithography and e-beam lithography
- Can be produced at commercial scale for low-cost, enabling the transition to spin-on carbon from vapor deposition
- Enables single patterning at finer resolutions, which reduces or eliminates the need for costly and complex multi-patterning
- Leads to faster processor speed, and up to 50% lower power consumption through FinFET/Trigate architecture
Click here for more technical information on the applications of fullerene-based photoresists and hard masks, and how they will enable the progression of Moore’s Law.
Contact Nano-C to learn more about its proven fullerene materials that can meet your semiconductor manufacture needs.